Quartz barrel microwave plasma ashing machine is suitable for batch wafer PR removal and descum applications, including wafer sizes up to 8"
-Batch wafer surface activation
-Batch wafer photoresist removal
-Removal of MEMS sacrificial layers
-DESCUM process
-Quartz material chamber
-Drawer door with view window with quartz boat support rod (optional quartz boat)
-Standard 2 gas channels with MFC (optional up to 4 channels)
-Supports batch processing of up to 8 "wafers
-2.45Ghz microwave source, power 50-1200W adjustable
-Standard dry pump (optional oil pump)