This is an excellent performance of automatic microwave plasma asher machine, it is integrated with a precise temperature control system, can achieve rapid batch degumming of wafers within 12 inches.
-Photoresist removal
-PI and SU-8 removal
-MEMS sacrificial layer removal/release
-Descum
-Wafer surface activation
-Suitable for 300mm and below size materials
-All aluminum metal chamber
-Wafer handling by robot arm, compatible with 2 ~ 8 inch wafer, 1 wafer per cycle
-Temperature controlled hot plate can realize heating and temperature control within 200℃(optional max to 250℃ )
-Water cooling system inside the chamber (external cooling water required)
-2.45GHz microwave plasma source
-Continuous adjustable power within 1200W
-Standard 2-way process gas with digital flow controller
-10.4-inch touch screen control, graphical process menu editing
-OS system, export file compatible with common office format
-Highly integrated, installation size less than 1 square meter
-Cost-effective
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