This is a general purpose floor microwave plasma cleaning machine, suitable for large-scale production applications. Support substrate, leadframe or wafer cleaning applications before packaging. It is generally used before wire bonding, molding, underfill,soldering and other processes. It can also be used for pre-stack/wafer surface activation.
-Chip Package Cleaning (PCB,LF,SiP etc)
-Wafer Cleaning (Max.300*400mm)
-Fan-in/out WLP Solutions
-Microfluidic Chip PDMS Bonding
-Surface Activation
-Oxide/Organics Removal
-Option 1: ECR, for ≤85*300mm materials, 6 magazines per batch
-Option 3: for ≤ L260*W260*H300mm material basket
-2.45GHz microwave plasma source, output between 0~1200W.
-High-Performance CPU, 10.4” touch-screen, windows OS, Ethernet, USB, RS 232
-Option 2: Horizontal ECR, for ≤300*400mm substrate or wafer, 5 layers per batch
-Option 4: for ≤350*400mm materials, single layer per batch
-2 digital Mass Flow Controllers (including valves) standard, up to 4 gas lines.
-Base presure ≤ 10Pa, dry pump/ oil pump optional.