ASTRO STRIP-3L is a 3 layers microwave plasma cleaning machine,3 times UPH,suitable for large-scale production applications. Support substrate, lead frame or wafer cleaning applications before packaging. It is generally used before wire bonding, molding, underfill,soldering and other processes. It can also be used for pre-stack/wafer surface activation.
-Improve die bonding
-Improve tin ball welding
-Improve flip-chip underfill
-Improve molding
-Our robust substrate loader and unloader offers to handle the most sensitive substrates with jam free solutions.
-New chamber together with our excellent microwave source can accomodate wide leadframes of about 108mm width with good uinformity.
-Chemical cleaning for sensitive devices (No sputtering).
-Especially useful for wide strips which are difficult to process in Magazines.
-Strip damage is prevented by use of force sensors.
-Our Innovative ASTRO STRIP-3L is a strip level plasma equipment with minimum substrates transportation.
-Microwave plasma process, which does not cause any surface erosion or redeposition.
-High throughput Multi Strip processing.Includes a fully automatic strip & magazine handling system.
-Easy & fast conversion bet. Different strips formats. No special tools required.